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Эпоксидный клей — структурный клей с высокой прочностью склеивания. Подходит для склеивания различных субстратов, особенно с высокой прочностью склеивания с металлическими материалами.
| Объект | Single-Component Epoxy | Two-Component Epoxy |
|---|---|---|
| Состав | Single resin with latent curing agent. | Resin + separate curing agent (e.g., polyamide). |
| Метод отверждения | Heat-activated (e.g., 80–180°C). | Mixing resin and curing agent; room temp. or heat-cured. |
| Ключевые приложения | Fast-production electronics, low-temp processes, consumer goods. | High-strength bonding (metals, composites), aerospace, automotive. |
| Наши преимущества | Simplified storage, rapid curing in heat, no mixing required. | Superior adhesion, chemical resistance, adjustable cure speed. |
| ограничения | Brittle when cured, limited shelf life (requires refrigeration). | Shorter pot life after mixing, requires precise mixing ratio. |
Compared to other types of adhesives, epoxy adhesives have better resistance to high temperatures and chemical corrosion, low shrinkage and cohesive strength, and are widely used in the fields of electronics, automotive, industry, and aviation.
Epoxy adhesives are divided into two types: single component and two-component. Single component epoxy adhesives can be divided into low-temperature curing epoxy, medium temperature curing epoxy, and high-temperature curing epoxy according to different curing temperatures. Low temperature curing epoxy is widely used in consumer electronics products. Its advantage is that the curing temperature is as low as 80 ℃ and the curing time can be controlled within 15-30 minutes. It can effectively meet the demand for fast production pace. Compared to single component products, two-component epoxy adhesives have a wider range of application scenarios and lower storage requirements. Typically, two-component epoxy does not require low-temperature storage.
В настоящее время, Moutainchem Electronics’ single component epoxy has mature applications in industries such as magnet bonding, motor bonding, VCM motor bonding, camera module bonding, and optical communication.
Epoxy Adhesive Systems Technical Summary
| Объект | Однокомпонентный | Двухкомпонентный |
|---|---|---|
| Состав | Pre-mixed resin/hardener | Separate resin & hardener |
| Механизм отверждения | С подогревом | Chemical reaction at RT or heat-accelerated |
| Жизнеспособность | N/A (pre-mixed) | 5 min – 24 hrs (varies by formulation) |
| Время отверждения | 15-60 min @ 120-180°C | 2 hrs – 7 days (RT cure) |
| Типичная вязкость | 10.000-50.000 сП | 5.000-30.000 cP (resin) |
| Условия хранения | -20°C to 5°C (uncured) | RT (separate components) |
| Срок годности | 3-12 месяцев | 12-24 месяцев |
Технические характеристики
| Параметр | Both Systems |
|---|---|
| Предел прочности на разрыв | 20-50 МПа |
| Прочность на сдвиг | 15-40 МПа |
| Температурное сопротивление | -40°C до +150°C (стандарт) |
| Химическая устойчивость | Excellent to oils, solvents |
| усадка |
Сравнение приложений
| Особенность | Однокомпонентный | Двухкомпонентный |
|---|---|---|
| Простота в использовании | Простое приложение | Requires mixing |
| Необходимое оборудование | Отопительная печь | Инструменты для смешивания |
| Best For | Крупносерийное производство | Пользовательские приложения |
| Bondable Substrates | Металлы, керамика | Металлы, пластмассы, композиты |
Безопасность и обращение
| Аспект | Both Systems |
|---|---|
| Контакт с кожей | Wear nitrile gloves |
| Защита глаз | Safety goggles required |
| Вентиляция | Adequate airflow needed |
| Cured Material | Неопасные |
Note:Single-component systems offer processing efficiency while two-component systems provide formulation flexibility. Selection depends on production requirements, substrate types, and performance needs.
Фабрика и отгрузка
